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University of Wisconsin Stem Cell & Regenerative Medicine Center

The Vanderby Laboratory

Faculty > Ray Vanderby

Ray Vanderby
Ray Vanderby

Ray Vanderby
Professor, Orthopedics and Rehabilitation, Biomedical Engineering
vanderby@orthorehab.wisc.edu

Vanderby Laboratory Home Page

Organ System/Disease Focus
Skeletal system tissue healing

Aligned Research Focus
Tissue regeneration of ligament, tendon, and cartilage

Research Description
I am particularly interested in orthopedic tissues (bone, ligament, tendon, cartilage, etc.). My research focuses on wound healing or regenerating these tissues via tissue engineering. This includes equal parts of functional characterization (e.g. biomechanics), microstructural morphology and composition, and the relevant biological sciences (cell and molecular biology, histology, etc.).

Additionally, I am interested in ultrasonic wave propagation in these tissues for clinically relevant characterization of tissue properties and functional loadings, as well as tissue regeneration for knee reconstruction procedures. To study these orthopedic issues, in my lab we use and adapt engineering and biological methods including experimental, analytical and computational approaches.

Selected References

Chamberlain CS, Leiferman EM, Frisch CE, Wang S, Yang X, van Rooijen N, Brickson SL, Vanderby R. The Influence of Macrophage Depletion on Ligament Healing. Conn Tiss Res. Nov. 2011 Jun;19(3):426-35. PMID: 21117894

Chamberlain CS, Leiferman, EM, Frisch CE, Wang S, Yang X, Brickson SL, Vanderby R.. The Influence of IL4 on Ligament Healing. Wound Repair Regen. 2011 May-Jun;19(3):426-35 PMID 21518087.

Frisch CE, Duenwald-Kuehl SE, Lakes RS, Vanderby R.. Quantification of collagen organization using fractal dimensions and Fourier transforms. Acta Histochem. 2012;114: 140-144. PMID: 21529898.

Chamberlain CS, Brounts SH, Sterken D, Rolnick K, Baer GS, Vanderby R.. Gene profiling of extracellular matrix factors during early ligament healing. J Appl Physiol. 2011 Aug;111(2):552-65. PMID: 21396919.